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4.75v to 18v, 2a/3a/4a 1 ch b uck c onverter with i ntegrated fet bd9325fj - lb bd9326efj - lb bd9327efj - lb general description this is the product guarantees long time support in industrial market. the bd9325fj - lb, bd9326efj - lb and bd9329efj C lb are step - down regulators with built - in low resistance high side n -c hannel mosfet. these ics can supply continuous output current of 2a / 3a / 4a respectively over a wide input range, and provides not only fast transient response, but also easy phase compensation because of current mode control. features ? long time support product f or industrial applications. ? low esr output ceramic capacitors are availa ble ? low stan d by current during shutdown mode ? feedback v oltage ? 0.9v 1.5%(ta=25 c) ? 0.9v 3 .0 % ( ta = -25 c to + 85 c) ? protection c ircuit: ? under voltage p rotection ? thermal s hutdown ? over - current p rotection applications industrial equipment distributed pow er system pre- regulator for linear regulator key specifications ? i nput v oltage ra nge: 4.75v to 18v ? o utput c urr e nt bd9327efj -lb : 4.0a (max) bd9326efj -lb : 3.0a (max) bd9325fj -lb : 2.0a (m ax) ? switching f requency: 380khz (typ) ? high side fet on -r esistance bd9327efj -lb : 0.11 (typ) bd9326efj -lb : 0.12 (typ) bd9325fj -lb : 0.16 (typ) ? low side fet on -r esistance: 10 (typ) ? s tandby c urrent: 8 0a (typ) ? operating t emperature r ange : - 40 c to +85 c packages (typ.) (typ.) (max.) htsop - j8 4.90mm x 6.00mm x 1.00mm sop- j8 4.90mm x 6.00mm x 1.65mm typical application circuit c_co1 r_pc 15 k r_dw r_up c_bs 0.1 f 10 h c_vc 1 10 f c _pc 1 33 00pf 10 k 27k 20 f c _ss 0.1 f l ss en comp fb bst v in gnd sw d thermal pad (for bd9326efj, bd9327efj) v in = 12v v out = 3.3v figure 1. typical application circuit sop - j 8 htsop - j8 product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive rays . 1/ 19 tsz02201 - 0323aaj00440 -1-2 ? 2012 rohm co., ltd. all rights reserved. 09.sep.2014 rev.003 tsz22111 ? 14 ? 001 www.rohm.com datashee t
bd9325fj - lb bd9326efj - lb bd9327efj - lb pin configurati on block diagram figure 2. pin configuration figure 3 . block diagram pin description pin no. pin n ame function 1 bst high -s ide g ate drive b oost i nput 2 vin power s upply i nput t erminal 3 sw power s witching o utput 4 gnd ground t erminal 5 fb feed back i nput 6 comp compensation n ode 7 en enable i nput 8 ss soft s tart c ontrol i nput ordering information b d 9 3 2 x x x x - l b e 2 part number b d932 xxxx package fj : sop-j8 efj : htsop-j8 product class lb for industrial applications packa ging and forming specification e2: embossed tape and reel lineup high side fet on resistance (typ.) output current (max.) package orderable part number 0.16 2.0 a sop-j8 reel of 2500 bd9325fj - lbe2 0.12 3.0 a htsop -j8 reel of 2500 bd9326efj -lbe2 0.11 4.0 a htsop -j8 reel of 2500 bd9327efj -lbe2 1 b s t s s 8 2 v i n e n 7 3 s w c o m p 6 4 g n d f b 5 v in (top view) 2/ 19 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201 - 0323aaj00440 -1-2
bd9325fj - lb bd9326efj - lb bd9327efj - lb absolute maximum ratings (ta = 25 c) parameter symbol rating unit supply voltage [ v in] v in 20 v switch voltage [sw] v sw 20 v power dissipation for htsop -j8 pd1 3.76 (note 1) w power dissipation for sop -j8 pd2 0.67 (note 2) w operating temperature range topr - 40 to +85 c storage temperature range ts t g - 55 to +150 c maximum j unction temperature tjmax 150 c bst voltage v bst v sw +7 v en voltage v en 20 v all o ther p ins v oth 7 v (note 1) mounted on 4 - layer 70mm x 70mm x 1.6mm board . reduce by 30.08mw/c f o r ta above 25c . (note 2) mounted on 1 - layer 70mm x 70mm x 1.6mm board. reduce by 5.4mw/c for ta above 25c . caution: operating the i c over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circu it between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fu se, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta= - 40 c to + 85 c) parameter symbol rating unit min typ max supply voltage v in 4.75 12 18 v sw voltage v sw - 0.5 - + 18 v output c urrent for bd9325fj i sw2 - - 2 (n ote 3) a output c urrent for bd9326efj i sw3 - - 3 (n ote 3) a output c urrent for bd9327efj i sw4 - - 4 (n ote 3) a ( note 3) pd, aso should not be exceeded electrical characteristics ( unless otherwise specified v in =12v ta=25 c) parameter symbol l imit unit conditions min typ max error a mplifier b lock fb i nput b ias c urrent i fb - 0.1 2 a feedback v oltage1 v fb1 0.886 0.900 0.914 v voltage f ollower feedback v oltage2 v fb2 0.873 0.900 0.927 v ta = - 40 c to + 85 c sw b lock C sw hi - s ide fet o n - r e sistance for bd9325fj r on2 - 0.16 - i sw = - 0.8a (n ote 4) hi - s ide fet o n - r esistance for bd9326efj r on3 - 0.12 - i sw = - 0.8a (n ote 4) hi - s ide fet o n - r esistance for bd9327efj r on4 - 0.11 - i sw = - 0.8a (n ote 4) lo w - s ide fet o n - r esistance r onl - 10 - i sw = 0.1a leak c urrent n - c hannel i leakn - 0 10 a v in = 18v, v sw = 0v switch current limit for bd9325fj i limit2 2.5 - - a ( n ote 4) switch current limit for bd9326efj i limit3 3.5 - - a ( n ote 4) switch current limit for bd9327efj i limit4 4.5 - - a (n ote 4) maximum d uty c ycle m duty - 90 - % v fb = 0v general enable sink c urrent i en 86 181 275 a v en = 12v enable threshold v oltage v en 1.1 1.18 1.4 v under voltage lockout t hreshold v uvlo 4.05 4.40 4.75 v v in r ising under voltage lockout hysteresis v hys - 0.1 - v soft start current i ss 23 41 62 a v ss = 0 v soft start time t ss - 1.6 - ms c ss = 0.1 f operating frequency f osc 300 380 460 khz circuit current i cc - 2.1 4.3 ma v fb = 1.5v, v en = 12v standby current i qui - 80 170 a v en = 0v (n ote 4) see the line up table . 3/ 19 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201 - 0323aaj00440 -1-2
bd9325fj - lb bd9326efj - lb bd9327efj - lb typical performance curves (unless otherwise specified, v in = 12v ta = 25 c) fig ure 4 . circuit current vs input voltage (no s witching) fig ure 5 . standby current vs input voltage (ic n ot active) fig ure 6 . input bias current vs feedback voltage fig ure 7 . feedback v oltage vs temperature v in :[v] v in :[v] v fb :[v] i fb :[ a ] temperatu re :[ c ] feedback voltage :[ v ] icc :[ ma ] icc :[ a ] 4/ 19 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201 - 0323aaj00440 -1-2
bd9325fj - lb bd9326efj - lb bd9327efj - lb typical performance curves - continued fig ure 9 . operating frequency vs temperature fig ure 10 . efficie ncy vs output current (v in = 12v v out = 3.3v l=10h) fig ure 8 . hi - side o n - re sistance vs temperature fig ure 11 . s oft start time vs soft start capacitor 320 330 340 350 360 370 380 390 -40 -20 0 20 40 60 80 temperature : [c] operating frequency [khz] temperature :[ c ] efficiency : [%] r on :[ ] ta: [ c ] i out : [ a ] s oft start time :[ ms] c ss : [ f ] 5/ 19 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201 - 0323aaj00440 -1-2
bd9325fj - lb bd9326efj - lb bd9327efj - lb typical waveforms fig ure 12 . over - current protection (v out is s horted to gnd) fig ure 13 . transient response (v in = 12v v out = 3.3v l= 10h c out =22f i out = 0.2 - 1.0a ) fig ure 14 . output ripple voltage (v in = 12v v out = 3.3v l= 10h c out =22f i out = 1.0a ) fig ure 15 . transient response (v in = 12v v out = 3.3v l= 10h c out =22f i out = 0.2 - 3.0a) 6/ 19 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201 - 0323aaj00440 -1-2
bd9325fj - lb bd9326efj - lb bd9327efj - lb typical waveforms - continued fig ure 17 . start up w aveform (v in = 12v v out = 3.3v l= 22h c ss = 0.1f i out = 0a) fig ure 16 . output ripple voltage (v in = 12v v out = 3.3v l= 10h c out =22f i out = 3.0a) 7/ 19 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201 - 0323aaj00440 -1-2
bd9325fj - lb bd9326efj - lb bd9327efj - lb application information 1. block operation (1) vreg this block generate s the constant - voltage needed for dc/dc boosting. (2) vref this block generates the 2.9 v internal reference voltage of the error amp. (3) tsd/uvlo tsd (thermal shutdown)/uvlo (under voltage lockout) are protection circuit block s. this circuit protects the device from damages due to excessive heat and power dissipation. when the tsd circuit is triggered by temperature exceeding the 175 c maximum junction temperature, it shuts down the device. once temperature falls below the threshold set by a hysteresis, the device resumes operation. uvlo circuit p revents error in the device operation due to either excessive or insufficient power supply voltage. it monitors the voltage level at vin pin and also the output of reg block. once vin voltage falls below 4.4v, the uvlo c ircuit disables the device and resets the soft - start circuit. typical uvlo hysteresis is 1 00 mv. (4) error a mp b lock (err) this circuit compare s the reference voltage and the feedback of output voltage. the com p pin voltage , which is the output of err block , determines the switching duty. durin g start up, the comp pin voltage is limited by ss pin voltage since the soft start is operated by the ss pin voltage. (5) oscillator b lock (osc) this block generates the internal oscillating frequency of the ic . (6) slope b lock this circuit is used to generate tr iangular wave form from the clock created by osc block . this triangular wave form is sent to the pwm comparator. (7) pwm b lock the comp pin voltage, which is the output of err block, is compared to the slope block's triangular waveform to determine the switching duty. since the switching duty is limited by the maximum duty ratio which is determined internally, it does not become 100%. (8) drv b lock this circuit is a dc/dc driver block. a signal from the pwm serves as the input to drive the power fets. (9) ocp b lock o cp (over - current protection) is a protection circuit block. the ocp block activates when the current flows through the fet is detected , and ocp starts when it reached 2.5 / 3.5 / 4.5a (min). after ocp, sw itching will turn off and ss capacitor will discharg e. ocp is a self - recovery type (not latch). (10) soft s tart c ircuit the soft - start feature reduces overshoot in the output by making the regulator reach steady- state gradually. the soft - start capacitor, c ss , which is connected to ss (pin 8) and gnd (pin4), sets the soft - start time, t ss . (refer to figure 2 3 to know how to set c ss .) 8/ 19 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201 - 0323aaj00440 -1-2
bd9325fj - lb bd9326efj - lb bd9327efj - lb 2. selecting application components (1) output lc c onstant (buck converter) the inductance l to be use d for the output is decided by the current rating i lr and maximum input current value i omax of the inductor . fig ure 18 fig ure 19 adjust i omax +?i l /2 so that it wont reach the current rating value i lr . at this time, ?i l can be obtained by the following equation. set with sufficient margin because the inductance l value may have a tolerance of 30%. for output capacitor c , select a capaci tor which has the larger value in the ripple voltage v pp permissible value and the drop voltage permissible value at the time of sudden load change. output ripple voltage is decided by the following equation. perform setting so that the voltage is within the permissible ripple voltage range. for the drop voltage v dr during sudden load change, please perform the rough calculation by the following equation. however, 10s is the rough calculation value of the dc/dc response speed. make co settings so that these two values will be within the limit values. (2) loop compensation choosing compensation c apacitor c 1 and r esistor r 3 the example of dc/dc converter application bode plot is shown in figure 21 . th e compensation resistor r3 will set the cross over frequency f c that decides the stability and response speed of dc/dc converter. so compensation resistor r3 has to be adjusted to adequate value for good stability and response speed. the cross over frequency f c can be adjusted by changing the compensation resistor r 3 connected to comp terminal. h igher cross over frequency achieves good response speed, but less stability , a nd the lower cross over frequency shows good stability, but worse response speed. usually, the 1/10 of dc/dc converter operating frequency is used for cross over frequency f c . so please decide the compensation resistor and capacitor using the following formula on setting f c to 1/10 of operating fre quency at first. after that, please measure and adjust the cross over frequency on your set (on the actual application) to meet the des ired speed and phase - margin. i l t i omax + ? i l /2 should not reach the rated value level i lr i omax mean current vo l v cc i l co ( ) [ ] a fv v vv l i cc o o cc l ?=? [ ] v fv v c i riv cc o o l esrl pp ? +?=? [ ] vs c i v o l dr ? = 9/ 19 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201 - 0323aaj00440 -1-2
bd9325fj - lb bd9326efj - lb bd9327efj - lb (a) choosing p hase c ompensation r esistor r3 please decide the compensation resistor r3 by following the formula below . compensation resister where c out is the output capacitor connected to dc/dc output v out is the output voltage f c is the desired cross over frequency (38khz) the larger value of r3, value of fc increase s ( response b etter and stability worse). the smaller value of r3, value of fc decrease s ( response worse and stability better). (b) choosing p hase c ompensation c apacitor c1 t he phase delay which is from output lc filter, needs to be cancelled to stabili ze the dc/dc conve rter, this is done by inserting the phase lead . the phase lead can be added by the zero introduced by the compensation resistor and capacitor. the lc resonant frequency f lc and the zero on compensation resistor and capacitor are expressed below. lc resonant frequency zero c1 and r3 please choose c1 to make f z to 1 / 3 of f lc . compensation capacitor (c) the c ondition of the l oop c ompensation s tability the stability of the dc/dc converter is important. to ensure the operating stability, please check the loop compensation if it has enough phase - margin. for the condition of loop compensation stability, the phase- lag must be less than 150 degree s whe n g ain is 0 db. namely over 30 degree s phase - margin is needed. lastly , after the calculation above, fin d measure s to adjust the phase - margin to more than 30 degree s. fig ure 20 fig ure 21 (3) design of feedback resistance c onstant set the feedback resistance as shown below. reference voltage [v] fig ure 22 phase margin 180 90 180 90 0 0 a (a) gbw(b) f f gain [db] phase f c v out r1 r2 c 1 comp r3 fb [ ] z out lc h lc f = [ ] z z h rc f = [ ] f rf c lc = + = r rr v out phase margin v out r1 r2 err reference v oltage fb [ ] ? = out out vfcc r 10/ 19 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 > 15> 001 tsz02201 - 0323aaj00440 -1-2
bd9325fj - lb bd9326efj - lb bd9327efj - lb (4) soft start function the buck converter has an adjustable soft start function to prevent high inrush current during start up. the soft - start time is set by the external capacitor connected to ss pin. the soft start time is given by; plea se confirm the overshoot of the output voltage and inrush current when deciding the ss capacitor value. fig ure 23 (5) en function the en terminal control the ics shut down. leaving en terminal open will shutdown the ic . to start the ic, en terminal should be connected to v in or the other power source output. when the en voltage exceed 1.2v (typ), the ic start operating. fig ure 24. the e quivalent i nternal c ircuit 3. selecting application components two high pulsing current flowing loops exist in the buck regulator system. the first loop, when fet is on, starts from the input capacitors, to the vin terminal, to the sw terminal, to the inductor, to the output capacitors, and then returns to the input capacitor through gnd. the second loop, when fet is off, starts from the schottky diode, to the inductor, to the output capacitor, and then returns to the schottky diode through gnd. to reduce the noise and improve the efficiency, please minimize these two loop area. especially input capacitor, output capacitor and schottky diode should be connected to gnd plane . pcb layout may affect the thermal performance, noise and efficiency greatly. so please take extra care when designing pcb layout patterns. c ss ss 2.9v (typ) + - comp 70k (typ) erramp v in en 66k (typ) 60k (typ) c in fet di c out l v out v in fig ure 25 . current l oop in buck r egulator s ystem [ ] sc tss ss = 11 / 19 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201 - 0323aaj00440 -1-2
bd9325fj - lb bd9326efj - lb bd9327efj - lb (1) the t herm al pad on the back side of ic serves as heat sink for thermal conduction to the chip. making the gnd pla ne as broad and wide as possible can help in thermal dissipation. a dd ing a lot of thermal via is also effective for helping t he spread of heat to the different layer. (2) the input capacitors should be connected as close as possible to the v in terminal. (3) when there is unused area on pcb, please arrange the copper foil pl ane of dc nodes, such as gnd, v in and v out for helping heat dissipation of ic or circumference parts. (4) make the trace of the switching line as short and thick as possible to coil t o avoid the noise influence of ac signals to combine with the other line . (5) keep sensitive signal traces such as trace connected fb and comp away from sw pin. (6) the inductor, the schottky diode and the output capacitors should be placed close as possible to sw pin . fig ure 2 6 . the e xample of pcb l ayout p attern ss bst vin sw gnd fb comp en c in c out l di fet v in sw v out 12/ 19 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201 - 0323aaj00440 -1-2
bd9325fj - lb bd9326efj - lb bd9327efj - lb i/o equivalen ce circuit 1.bst 3.sw 5.fb 6.comp 7.en 8.ss v in v in sw reg v in v in v in v in v in 13/ 19 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201 - 0323aaj00440 -1-2
bd9325fj - lb bd9326efj - lb bd9327efj - lb operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic s power supply pin s. 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. g round w iring p attern when using both small - signal and large- current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal c onsideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rati ng. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the conditions of each parameter . 7. inrush curren t when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground , power s upply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 14/ 19 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201 - 0323aaj00440 -1-2
bd9325fj - lb bd9326efj - lb bd9327efj - lb operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charg e acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. re garding the i nput p in of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p - n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitab ly occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore , conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. fig ure 29 . example of monolithic ic structure 13. thermal s hutdown c ircuit(tsd) this ic has a built - in thermal shutdown circuit that prevents heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls b elow the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 14. over c urrent p rotection c ircuit (ocp) this ic incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. this protection circuit is effect ive in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c b e transistor (npn) resistor n region close-by parasitic elements 15/ 19 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201 - 0323aaj00440 -1-2
bd9325fj - lb bd9326efj - lb bd9327efj - lb power dissipation marking diagrams part number marking package orderable part number d9325 sop-j8 bd9325fj - lbe2 d9326 htsop -j8 bd9326efj -lbe2 d9327 htsop - j8 bd9327efj - lbe2 sop - j8(top view) part number marking lot number 1pin mark htsop - j8(top view) part number marking lot number 1pin mark htsop - j8 package on 70 70 1.6 mm glass epo xy pcb (1) 1 - layer board ( backside copper foil area 0 mm 0 mm) (2) 2 - layer board ( backside copper f oil area 15 mm 15 mm) (3) 2 - layer board ( backside copper foil area 70 mm 70 mm) (4) 4 - layer board ( backside copper foil area 70 mm 70 mm) sop - j8 package on 70 70 1.6 mm glass epo xy pcb (1) 1 - layer board ( backside copper foil area 0 mm 0 mm) 1 50 0 50 75 100 125 2000 4000 1000 3000 2 5 power dissipation: pd [mw ] figure 2 9. ambient temperature: ta [ c ] (1)820mw (2)1100mw (3)2110mw (4)3760mw 0 150 0 50 75 100 125 2000 4000 1000 3000 2 5 power dissipation: pd [mw ] fi gure 30 . ambient temperature: ta [ c ] (1) 675 mw 0 16/ 19 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201 - 0323aaj00440 -1-2
bd9325fj - lb bd9326efj - lb bd9327efj - lb physical dimension s, tape and reel information package name sop - j8 17/ 19 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201 - 0323aaj00440 -1-2
bd9325fj - lb bd9326efj - lb bd9327efj - lb physical dimensions, tape and reel information - continued package name htsop - j8 18/ 19 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201 - 0323aaj00440 -1-2
bd9325fj - lb bd9326efj - lb bd9327efj - lb revision history date revision changes 05.aug.2013 001 new release 27 .feb.2014 002 delete sentence and log life cycle in general description and futures. applied new style ( title and phy sical dimension tape and reel information ) . 09.sep.2014 003 applied the rohm standard style and i mproved understandability in all pages . 19/ 19 09.sep.2014 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201 - 0323aaj00440 -1-2
datasheet datasheet notice ? ss rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class classb class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet datasheet notice ? ss rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bd9325fj-lb package sop-j8 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes bd9325fj-lb - web page distribution inventory

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